{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704841","patent":{"patent_number":"US-9704841","title":"Method of packaging stacked dies on wafer using flip-chip bonding","assignee":null,"inventors":[],"filing_date":"2014-03-26T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A wafer package process includes the following steps. A wafer with a plurality of first dies is provided. A plurality of second dies are bonded on the first dies by using flip chip technology, wherein the size of the first die is larger than that of the second die. A molding material is formed to entirely cover the second dies and the wafer. A through via is formed in the molding material. A conductive material is formed to fill the through via onto the molding material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of packaging stacked dies on wafer using flip-chip bonding","description":"A wafer package process includes the following steps. A wafer with a plurality of first dies is provided. A plurality of second dies are bonded on the first dies by using flip chip technology, wherein","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704841","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704841","citation_suggestion":"Patentable. \"Method of packaging stacked dies on wafer using flip-chip bonding\" (US-9704841). https://patentable.app/patents/US-9704841","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704841","json":"https://patentable.app/api/llm-context/US-9704841","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:33:08.505Z"}