{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9706637","patent":{"patent_number":"US-9706637","title":"Method for producing a circuit board system","assignee":null,"inventors":[],"filing_date":"2013-08-22T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for producing a circuit board system","description":"Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top si","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9706637","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9706637","citation_suggestion":"Patentable. \"Method for producing a circuit board system\" (US-9706637). https://patentable.app/patents/US-9706637","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9706637","json":"https://patentable.app/api/llm-context/US-9706637","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:04:21.724Z"}