{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9706639","patent":{"patent_number":"US-9706639","title":"Circuit board and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-03-15T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":15,"abstract":"Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes a core layer comprising a first surface and a second surface opposing the first surface, at least one first build-up layer formed on the first surface, and comprising a first conductive pattern and a first conductive via, at least one second build-up layer formed on the second surface, and comprising a second conductive pattern and a second conductive via, a cavity formed to pass through the core layer, the first build-up layer and the second build-up layer, and a heat dissipation unit disposed inside the cavity, and an outer layer formed on a surface of the first build-up layer and a surface of the second build-up layer and the outer layer being configured to be connected to the heat dissipation unit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit board and method of manufacturing the same","description":"Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes a core layer comprising a first surface and a second surface opposing the first surface, at least one f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9706639","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9706639","citation_suggestion":"Patentable. \"Circuit board and method of manufacturing the same\" (US-9706639). https://patentable.app/patents/US-9706639","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9706639","json":"https://patentable.app/api/llm-context/US-9706639","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:55:39.337Z"}