{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9706655","patent":{"patent_number":"US-9706655","title":"Packaging for high power integrated circuits and infrared emitter arrays","assignee":null,"inventors":[],"filing_date":"2014-07-09T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":34,"abstract":"A product and method for packaging high power integrated circuits or infrared emitter arrays for operation through a wide range of temperatures, including cryogenic operation. The present invention addresses key limitations with the prior art, by providing temperature control through direct thermal conduction or active fluid flow and avoiding thermally induced stress on the integrated circuits or emitter arrays. The present invention allows for scaling of emitter arrays up to extremely large formats, which is not viable under the prior art."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging for high power integrated circuits and infrared emitter arrays","description":"A product and method for packaging high power integrated circuits or infrared emitter arrays for operation through a wide range of temperatures, including cryogenic operation. The present invention ad","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9706655","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9706655","citation_suggestion":"Patentable. \"Packaging for high power integrated circuits and infrared emitter arrays\" (US-9706655). https://patentable.app/patents/US-9706655","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9706655","json":"https://patentable.app/api/llm-context/US-9706655","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:57:08.139Z"}