{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9708175","patent":{"patent_number":"US-9708175","title":"Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same","assignee":null,"inventors":[],"filing_date":"2015-10-13T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":20,"abstract":"A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same","description":"A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9708175","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9708175","citation_suggestion":"Patentable. \"Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same\" (US-9708175). https://patentable.app/patents/US-9708175","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9708175","json":"https://patentable.app/api/llm-context/US-9708175","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:19:10.539Z"}