{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711378","patent":{"patent_number":"US-9711378","title":"Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device","assignee":null,"inventors":[],"filing_date":"2014-11-28T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 μm as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device","description":"The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an aci","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711378","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711378","citation_suggestion":"Patentable. \"Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device\" (US-9711378). https://patentable.app/patents/US-9711378","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711378","json":"https://patentable.app/api/llm-context/US-9711378","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:18:44.596Z"}