{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711434","patent":{"patent_number":"US-9711434","title":"Stacked semiconductor device structure and method","assignee":null,"inventors":[],"filing_date":"2016-07-25T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H02M","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A stacked semiconductor device structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a recessed surface portion bounded by opposing sidewall portions extending outward to define a recessed region. A conductive layer is disposed along at least the recessed surface portion. The second semiconductor device is disposed within the recessed region and is electrically connected to the conductive layer. In one embodiment, the stacked semiconductor device is connected to a conductive lead frame and is at least partially encapsulated by a package body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked semiconductor device structure and method","description":"A stacked semiconductor device structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a recessed surface portion bounded by opposing","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711434","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711434","citation_suggestion":"Patentable. \"Stacked semiconductor device structure and method\" (US-9711434). https://patentable.app/patents/US-9711434","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711434","json":"https://patentable.app/api/llm-context/US-9711434","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:27:17.521Z"}