{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711439","patent":{"patent_number":"US-9711439","title":"Printed wiring board and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2015-09-01T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A printed wiring board includes an insulating layer including insulating material, and a conductor layer formed on a surface of the insulating layer and including conductor pads and conductor patterns such that the conductor pads are positioned to connect one or more electronic components and that the conductor patterns are formed between the conductor pads. The conductor patterns are formed such that each conductor pattern has a pattern width of 3 μm or less and that the conductor patterns have a pattern interval of 3 μm or less between adjacent conductor patterns, and the insulating layer has recess portions formed on the surface between the conductor patterns at least along the conductor patterns such that the recess portions have a depth in a range of 0.1 μm to 2.0 μm relative to a contact interface at which the conductor patterns and the insulating layer are in contact with each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board and method for manufacturing the same","description":"A printed wiring board includes an insulating layer including insulating material, and a conductor layer formed on a surface of the insulating layer and including conductor pads and conductor patterns","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711439","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711439","citation_suggestion":"Patentable. \"Printed wiring board and method for manufacturing the same\" (US-9711439). https://patentable.app/patents/US-9711439","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711439","json":"https://patentable.app/api/llm-context/US-9711439","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:26:44.841Z"}