{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711440","patent":{"patent_number":"US-9711440","title":"Wiring board and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2015-11-09T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A wiring board includes a core substrate including an insulating layer and a conductor layer formed on the insulating layer, and a build-up layer laminated on the substrate and including an inter-layer insulating layer and a conductor layer laminated on the inter-layer. The substrate has opening penetrating through the insulating layer such that surface of the conductor layer in the substrate is forming bottom of the opening, the substrate has a via conductor formed in the opening and including plating filling the opening, the conductor layer in the substrate includes a metal foil, the conductor layer in the build-up layer includes a metal foil, and the metal foil in the substrate has surface in contact with the surface of the insulating layer such that the surface of the metal foil in the substrate has surface roughness smaller than surface roughness of surface of the metal foil in the build-up layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring board and method for manufacturing the same","description":"A wiring board includes a core substrate including an insulating layer and a conductor layer formed on the insulating layer, and a build-up layer laminated on the substrate and including an inter-laye","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711440","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711440","citation_suggestion":"Patentable. \"Wiring board and method for manufacturing the same\" (US-9711440). https://patentable.app/patents/US-9711440","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711440","json":"https://patentable.app/api/llm-context/US-9711440","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:24:32.075Z"}