{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711446","patent":{"patent_number":"US-9711446","title":"Resin composition","assignee":null,"inventors":[],"filing_date":"2016-11-29T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 μm, the product of the specific surface area (m2/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m2/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g·mm/m2·24 h are useful for making printed wiring boards."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resin composition","description":"Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711446","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711446","citation_suggestion":"Patentable. \"Resin composition\" (US-9711446). https://patentable.app/patents/US-9711446","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711446","json":"https://patentable.app/api/llm-context/US-9711446","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:39:58.577Z"}