{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711465","patent":{"patent_number":"US-9711465","title":"Antenna cavity structure for integrated patch antenna in integrated fan-out packaging","assignee":null,"inventors":[],"filing_date":"2016-02-29T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated fan-out package having a top-side redistribution wiring structure, a back-side redistribution wiring layer, a ground plane provided in the back-side redistribution wiring layer, and a molding compound layer having a thickness and provided between the back-side redistribution wiring layer and the top-side redistribution wiring structure is disclosed. The package has an RF IC die embedded within the molding compound layer and one or more integrated patch antenna structure provided in the top-side redistribution wiring structure. The one or more integrated patch antenna structure is coupled to the RF IC die and an antenna cavity is provided within the molding compound layer under each of the one or more integrated patch antenna."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Antenna cavity structure for integrated patch antenna in integrated fan-out packaging","description":"An integrated fan-out package having a top-side redistribution wiring structure, a back-side redistribution wiring layer, a ground plane provided in the back-side redistribution wiring layer, and a mo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711465","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711465","citation_suggestion":"Patentable. \"Antenna cavity structure for integrated patch antenna in integrated fan-out packaging\" (US-9711465). https://patentable.app/patents/US-9711465","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711465","json":"https://patentable.app/api/llm-context/US-9711465","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:34:15.101Z"}