{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711475","patent":{"patent_number":"US-9711475","title":"Bump structural designs to minimize package defects","assignee":null,"inventors":[],"filing_date":"2015-10-09T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of forming a chip package includes providing a chip with a plurality of first bumps, wherein the plurality of first bumps has a first height. The method further includes providing a substrate with a plurality of second bumps, wherein the plurality of second bumps has a second height. The method further includes bonding the plurality of first bumps to the plurality of second bumps to form a first bump structure of the chip package, wherein the first bump structure has a standoff, wherein a ratio of a sum of the first height and the second height to the standoff is equal to or greater than about 0.6 and less than 1."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bump structural designs to minimize package defects","description":"A method of forming a chip package includes providing a chip with a plurality of first bumps, wherein the plurality of first bumps has a first height. The method further includes providing a substrate","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711475","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711475","citation_suggestion":"Patentable. \"Bump structural designs to minimize package defects\" (US-9711475). https://patentable.app/patents/US-9711475","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711475","json":"https://patentable.app/api/llm-context/US-9711475","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:32:04.081Z"}