{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711479","patent":{"patent_number":"US-9711479","title":"Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2014-07-02T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A die package having a plurality of connection pads, a plurality of wire leads having metal cores with a defined core diameter, and a dielectric layer surrounding the metal cores having a defined dielectric thickness, at least one first connection pad held in a mold compound covering the die and the plurality of leads connected to at least one metal core, and at least one second connection pad held in the mold compound covering the die and the plurality of leads connected to at least one metal core. Further, the present invention relates to a method for manufacturing a substrate less die package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same","description":"A die package having a plurality of connection pads, a plurality of wire leads having metal cores with a defined core diameter, and a dielectric layer surrounding the metal cores having a defined diel","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711479","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711479","citation_suggestion":"Patentable. \"Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same\" (US-9711479). https://patentable.app/patents/US-9711479","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711479","json":"https://patentable.app/api/llm-context/US-9711479","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:47:55.062Z"}