{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711483","patent":{"patent_number":"US-9711483","title":"Bonding apparatus","assignee":null,"inventors":[],"filing_date":"2014-10-28T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding apparatus","description":"A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head liftin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711483","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711483","citation_suggestion":"Patentable. \"Bonding apparatus\" (US-9711483). https://patentable.app/patents/US-9711483","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711483","json":"https://patentable.app/api/llm-context/US-9711483","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:43:07.354Z"}