{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711488","patent":{"patent_number":"US-9711488","title":"Semiconductor package assembly","assignee":null,"inventors":[],"filing_date":"2016-02-03T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":23,"abstract":"The invention provides a semiconductor package assembly. The semiconductor package assembly includes a semiconductor die. A first molding compound covers a back surface of the semiconductor die. A redistribution layer (RDL) structure is disposed on a front surface of the semiconductor die. The semiconductor die is coupled to the RDL structure. A second molding compound is disposed on the front surface of the semiconductor die and embedded in the RDL structure. A passive device is disposed on the second molding compound and coupled to the semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package assembly","description":"The invention provides a semiconductor package assembly. The semiconductor package assembly includes a semiconductor die. A first molding compound covers a back surface of the semiconductor die. A red","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711488","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711488","citation_suggestion":"Patentable. \"Semiconductor package assembly\" (US-9711488). https://patentable.app/patents/US-9711488","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711488","json":"https://patentable.app/api/llm-context/US-9711488","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:17:32.104Z"}