{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9711630","patent":{"patent_number":"US-9711630","title":"Semiconductor device and an electronic device","assignee":null,"inventors":[],"filing_date":"2016-01-27T00:00:00.000Z","publication_date":"2017-07-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor device, includes a semiconductor chip which includes: first and second terminals; a first conductive film pattern for the first terminal, formed over an interlayer insulation film; an insulation film formed over the interlayer insulation film so as to cover the first conductive film pattern; a first opening for the first terminal formed in the insulation film, and for exposing a part of the first conductive film pattern; and a nickel film formed over the first conductive film pattern at a portion thereof exposed from the first opening, wherein a semiconductor element controls a conduction between the first terminal and the second terminal, wherein the first terminal is formed of the first conductive film pattern and the nickel film, wherein the first conductive film pattern is formed of a lamination film having a first conductor film containing aluminum, and a second conductor film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and an electronic device","description":"A semiconductor device, includes a semiconductor chip which includes: first and second terminals; a first conductive film pattern for the first terminal, formed over an interlayer insulation film; an ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9711630","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9711630","citation_suggestion":"Patentable. \"Semiconductor device and an electronic device\" (US-9711630). https://patentable.app/patents/US-9711630","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9711630","json":"https://patentable.app/api/llm-context/US-9711630","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:04:54.765Z"}