{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9714879","patent":{"patent_number":"US-9714879","title":"Electrically conductive barriers for integrated circuits","assignee":null,"inventors":[],"filing_date":"2015-08-21T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"Electrically conductive barriers for integrated circuits and integrated circuits and methods including the electrically conductive barriers. The integrated circuits include a semiconductor substrate, a semiconductor device supported by a device portion of the substrate, and a plurality of bond pads supported by a bond pad portion of the substrate. The integrated circuits also include an electrically conductive barrier that projects away from an intermediate portion of the substrate and is configured to decrease capacitive coupling between the device portion and the bond pad portion. The methods can include methods of manufacturing an integrated circuit. These methods include forming a semiconductor device, forming a plurality of bond pads, forming a plurality of electrically conductive regions, and forming an electrically conductive barrier. The methods also can include methods of operating an integrated circuit. These methods include applying an input electric signal, receiving an output electric signal, and applying a reference potential."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electrically conductive barriers for integrated circuits","description":"Electrically conductive barriers for integrated circuits and integrated circuits and methods including the electrically conductive barriers. The integrated circuits include a semiconductor substrate, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9714879","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9714879","citation_suggestion":"Patentable. \"Electrically conductive barriers for integrated circuits\" (US-9714879). https://patentable.app/patents/US-9714879","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9714879","json":"https://patentable.app/api/llm-context/US-9714879","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:18:30.627Z"}