{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716017","patent":{"patent_number":"US-9716017","title":"Semiconductor packages including interposer and methods of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2015-12-03T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor package may include a semiconductor die mounted on a first surface of an interposer die so that a die connection portion of the semiconductor die faces to the first surface of the interposer die, a protection portion may be disposed on the first surface of the interposer die to cover the semiconductor die, and an interconnection structure disposed in and on the interposer die. The interconnection structure may include an external connection portion that is located on a second surface of the interposer die opposite to the semiconductor die, a through electrode portion that penetrates the interposer die to have an end portion combined with the die connection portion, and an extension portion that connects the through electrode portion to the external connection portion. Related methods are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including interposer and methods of manufacturing the same","description":"A semiconductor package may include a semiconductor die mounted on a first surface of an interposer die so that a die connection portion of the semiconductor die faces to the first surface of the inte","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716017","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716017","citation_suggestion":"Patentable. \"Semiconductor packages including interposer and methods of manufacturing the same\" (US-9716017). https://patentable.app/patents/US-9716017","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716017","json":"https://patentable.app/api/llm-context/US-9716017","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:50:53.060Z"}