{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716023","patent":{"patent_number":"US-9716023","title":"Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies","assignee":null,"inventors":[],"filing_date":"2014-07-15T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A method of bonding a device wafer to a carrier wafer includes disposing a first adhesive over a central portion of a carrier wafer, the first adhesive having a first glass transition temperature, disposing a second adhesive over a peripheral portion of the carrier wafer, the second adhesive having a second glass transition temperature greater than the first glass transition temperature, and bonding the first adhesive to an active front side of the device wafer and the second adhesive to a peripheral portion of the front side of the device wafer. Related assemblies may be used in such methods."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies","description":"A method of bonding a device wafer to a carrier wafer includes disposing a first adhesive over a central portion of a carrier wafer, the first adhesive having a first glass transition temperature, dis","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716023","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716023","citation_suggestion":"Patentable. \"Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies\" (US-9716023). https://patentable.app/patents/US-9716023","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716023","json":"https://patentable.app/api/llm-context/US-9716023","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:39:33.864Z"}