{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716026","patent":{"patent_number":"US-9716026","title":"Resin composition, cured film, laminated film, and method for manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2013-09-25T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":15,"abstract":"[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180° C., and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250° C., and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition.[Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition.(n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. R1 and R2 may be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. R3 to R6 may be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)"},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resin composition, cured film, laminated film, and method for manufacturing semiconductor device","description":"[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180° C., and whose production of a volatile portion due to decomp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716026","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716026","citation_suggestion":"Patentable. \"Resin composition, cured film, laminated film, and method for manufacturing semiconductor device\" (US-9716026). https://patentable.app/patents/US-9716026","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716026","json":"https://patentable.app/api/llm-context/US-9716026","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:19:51.041Z"}