{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716031","patent":{"patent_number":"US-9716031","title":"Semiconductor wafer and method of concurrently testing circuits formed thereon","assignee":null,"inventors":[],"filing_date":"2014-04-08T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor wafer has a non-uniform array of integrated circuit dies formed on it. Each die is enclosed by a respective seal ring, and each die has a group of bond pads and probe pad coupled to the bond pads. Common electrical interconnects selectively electrically couple together respective probe pads of each of the dies. The common electrical interconnects allow the dies to be tested concurrently before being cut from the wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor wafer and method of concurrently testing circuits formed thereon","description":"A semiconductor wafer has a non-uniform array of integrated circuit dies formed on it. Each die is enclosed by a respective seal ring, and each die has a group of bond pads and probe pad coupled to th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716031","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716031","citation_suggestion":"Patentable. \"Semiconductor wafer and method of concurrently testing circuits formed thereon\" (US-9716031). https://patentable.app/patents/US-9716031","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716031","json":"https://patentable.app/api/llm-context/US-9716031","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:37:21.800Z"}