{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716040","patent":{"patent_number":"US-9716040","title":"Wafer processing method using adhesive tape to pick up device chips","assignee":null,"inventors":[],"filing_date":"2016-08-11T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A wafer processing method of processing a wafer with a plurality of devices disposed in areas demarcated by projected division lines and formed on a face side thereof includes a protective member placing step of placing a protective member for protecting the face side of the wafer on the face side of the wafer which is divided into individual device chips, a resin laying step of laying a die-bonding resin on the reverse sides of the individual device chips by applying a die-bonding liquid resin on the reverse side of the wafer and hardening the applied die-bonding liquid resin, and a separation step of separating the device chips with the die-bonding liquid resin laid on the reverse sides thereof from the wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method using adhesive tape to pick up device chips","description":"A wafer processing method of processing a wafer with a plurality of devices disposed in areas demarcated by projected division lines and formed on a face side thereof includes a protective member plac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716040","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716040","citation_suggestion":"Patentable. \"Wafer processing method using adhesive tape to pick up device chips\" (US-9716040). https://patentable.app/patents/US-9716040","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716040","json":"https://patentable.app/api/llm-context/US-9716040","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:19:58.677Z"}