{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716057","patent":{"patent_number":"US-9716057","title":"Offset leadframe cascode package","assignee":null,"inventors":[],"filing_date":"2016-08-24T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A composite semiconductor device, such as a high-voltage cascode, is constructed in a single package by mounting a first die on a first planar substrate and second die mounted on a second planar substrate, where the substrates are separated by a gap filled with a dielectric encapsulant. The substrates may be separated both vertically and as well as laterally, to lie in different parallel planes. The substrates are in a leadframe that also includes interconnections, heat sinks, package pins, and removable tie-bars, forming a contiguous metallic structure. Multi-device frames containing multiple leadframes joined by additional tie-bars may be used to process multiple composite semiconductor devices together in, e.g., step-and-repeat wire and die bonding processes and batch encapsulation molding batch processes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Offset leadframe cascode package","description":"A composite semiconductor device, such as a high-voltage cascode, is constructed in a single package by mounting a first die on a first planar substrate and second die mounted on a second planar subst","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716057","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716057","citation_suggestion":"Patentable. \"Offset leadframe cascode package\" (US-9716057). https://patentable.app/patents/US-9716057","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716057","json":"https://patentable.app/api/llm-context/US-9716057","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:47:21.935Z"}