{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716060","patent":{"patent_number":"US-9716060","title":"Package structure with an embedded electronic component and method of fabricating the package structure","assignee":null,"inventors":[],"filing_date":"2015-04-22T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure with an embedded electronic component and method of fabricating the package structure","description":"The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carri","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716060","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716060","citation_suggestion":"Patentable. \"Package structure with an embedded electronic component and method of fabricating the package structure\" (US-9716060). https://patentable.app/patents/US-9716060","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716060","json":"https://patentable.app/api/llm-context/US-9716060","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:19:49.068Z"}