{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9716065","patent":{"patent_number":"US-9716065","title":"Via bottom structure and methods of forming","assignee":null,"inventors":[],"filing_date":"2015-09-14T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Various embodiments include methods and integrated circuit structures. One method includes: forming a via opening through a trench to expose a portion of an underlying metal line; electrolessly plating a metal layer at a bottom of the via opening over the exposed portion of the underlying metal line, the electrolessly plated metal layer formed of a metal not including copper; depositing a cobalt layer to cover the bottom of the via opening over the electrolessly plated metal layer and sidewalls of the via opening; and growing a copper layer over the cobalt layer to form a line within the trench and a via filling the via opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Via bottom structure and methods of forming","description":"Various embodiments include methods and integrated circuit structures. One method includes: forming a via opening through a trench to expose a portion of an underlying metal line; electrolessly platin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9716065","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9716065","citation_suggestion":"Patentable. \"Via bottom structure and methods of forming\" (US-9716065). https://patentable.app/patents/US-9716065","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9716065","json":"https://patentable.app/api/llm-context/US-9716065","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:16:52.422Z"}