{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9717145","patent":{"patent_number":"US-9717145","title":"Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles","assignee":null,"inventors":[],"filing_date":"2015-11-27T00:00:00.000Z","publication_date":"2017-07-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"Apparatus and method for filling and optionally bumping through-silicon vias (TSVs) in device circuits utilizing inkjet printheads for ejecting sufficiently small droplets of conductive nanoparticle inks into the TSVs. Ejected drops are accurately impinged along the length of each TSV within a substrate being heated to drive evaporation of the solvent carrying the metal nanoparticles into the trenches while not de-encapsulating the particles. Once all TSVs are filled, and optionally bumped, to a desired level while they are being heated then bonding and sintering can be performed, such as utilizing thermocompression bonding to another integrated circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles","description":"Apparatus and method for filling and optionally bumping through-silicon vias (TSVs) in device circuits utilizing inkjet printheads for ejecting sufficiently small droplets of conductive nanoparticle i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9717145","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9717145","citation_suggestion":"Patentable. \"Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles\" (US-9717145). https://patentable.app/patents/US-9717145","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9717145","json":"https://patentable.app/api/llm-context/US-9717145","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:15:39.178Z"}