{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9721837","patent":{"patent_number":"US-9721837","title":"Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same","assignee":null,"inventors":[],"filing_date":"2015-06-24T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","G01S","G01S","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A method for wafer level fabricating a plurality of optoelectronic devices, starting with a wafer that includes a plurality of light detector sensor regions, includes attaching each of a plurality of light source dies to one of a plurality of bond pads on a top surface of the wafer that includes the plurality of light detector sensor regions. The method also includes attaching, to the wafer, a preformed opaque structure made off-wafer from an opaque material, wherein the preformed opaque structure includes opaque vertical optical barriers. Additionally, solder balls or other electrical connectors are attached to the bottom of the wafer. The wafer is diced to separate the wafer into a plurality of optoelectronic devices, each of which includes at least one of the light detector sensor regions, at least one of the light source dies and at least two of the solder balls or other electrical connectors."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same","description":"A method for wafer level fabricating a plurality of optoelectronic devices, starting with a wafer that includes a plurality of light detector sensor regions, includes attaching each of a plurality of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9721837","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9721837","citation_suggestion":"Patentable. \"Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same\" (US-9721837). https://patentable.app/patents/US-9721837","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9721837","json":"https://patentable.app/api/llm-context/US-9721837","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:23:39.527Z"}