{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9721850","patent":{"patent_number":"US-9721850","title":"Method for making a three dimensional integrated electronic circuit","assignee":null,"inventors":[],"filing_date":"2016-01-12T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A method for making a three-dimensional integrated electronic circuit is provided, including making a first electrically conductive portion on a first dielectric layer covering a first semiconductor layer; then making a second dielectric layer covering the first electrically conductive portion such that it is disposed between the first and second dielectric layers, and a second semiconductor layer disposed on the second dielectric layer; then making a first electronic component in the second semiconductor layer, and a second electronic component in the first semiconductor layer; then making an electrical interconnection electrically linking the first and second electronic components together, of which a first part passes through the first dielectric layer and electrically connects the second electronic component to the first electrically conductive portion and of which a second part passes through a part of the second dielectric layer and electrically connects the first electronic component to the first electrically conductive portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for making a three dimensional integrated electronic circuit","description":"A method for making a three-dimensional integrated electronic circuit is provided, including making a first electrically conductive portion on a first dielectric layer covering a first semiconductor l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9721850","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9721850","citation_suggestion":"Patentable. \"Method for making a three dimensional integrated electronic circuit\" (US-9721850). https://patentable.app/patents/US-9721850","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9721850","json":"https://patentable.app/api/llm-context/US-9721850","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T17:45:54.461Z"}