{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9721878","patent":{"patent_number":"US-9721878","title":"High density second level interconnection for bumpless build up layer (BBUL) packaging technology","assignee":null,"inventors":[],"filing_date":"2012-09-28T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the device side of the die, an ultimate conductive layer patterned into a plurality of pads or lands; and a grid array including a plurality of conductive posts disposed on respective ones of the plurality of pads of the ultimate conductive layer of the body, at least one of the posts coupled to at least one of the contact points of the die through at least a portion of the conductive material of the body. A method including forming a body of a build-up carrier including a die, the body of the build-up carrier including an ultimate conductive layer and forming a grid array including a plurality of conductive posts on the ultimate conductive layer of the body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High density second level interconnection for bumpless build up layer (BBUL) packaging technology","description":"An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9721878","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9721878","citation_suggestion":"Patentable. \"High density second level interconnection for bumpless build up layer (BBUL) packaging technology\" (US-9721878). https://patentable.app/patents/US-9721878","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9721878","json":"https://patentable.app/api/llm-context/US-9721878","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:41:24.094Z"}