{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9721880","patent":{"patent_number":"US-9721880","title":"Integrated circuit package structures","assignee":null,"inventors":[],"filing_date":"2015-12-15T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"Integrated circuit (IC) package structures, and related devices and methods, are disclosed herein. In some embodiments, an IC package substrate may include: a dielectric layer having a first face and a second face; a metal layer disposed at the first face of the dielectric layer and having a first face and a second face, wherein the second face of the metal layer is disposed between the first face of the metal layer and the second face of the dielectric layer; a package contact at the first face of the metal layer to couple the IC package substrate to a component; and a die contact at the first face of the metal layer to couple a die to the IC package substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package structures","description":"Integrated circuit (IC) package structures, and related devices and methods, are disclosed herein. In some embodiments, an IC package substrate may include: a dielectric layer having a first face and ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9721880","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9721880","citation_suggestion":"Patentable. \"Integrated circuit package structures\" (US-9721880). https://patentable.app/patents/US-9721880","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9721880","json":"https://patentable.app/api/llm-context/US-9721880","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:40:39.692Z"}