{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9721913","patent":{"patent_number":"US-9721913","title":"Semiconductor package and method of manufacturing thereof","assignee":null,"inventors":[],"filing_date":"2016-08-18T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","G02F","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A semiconductor package comprises a semiconductor chip having an active surface with a conductive pad thereon; an electroplated Au—Sn alloy bump over the active surface; and a (glass) substrate comprising conductive traces electrically coupling with the electroplated Au—Sn alloy bump, wherein the electroplated Au—Sn alloy bump has a composition from about Au0.35Sn0.15 to about Au0.75Sn0.25 in weight percent uniformly distributed from an end in proximity to the active surface to an end in proximity to the substrate. A method of manufacturing a semiconductor package comprises forming patterns of conductive pads on an active surface of a semiconductor chip; electroplating Au—Sn alloy bump over the conductive pads; and bonding the semiconductor chip on a corresponding conductive trace on a substrate by a reflow operation or a thermal press operation."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and method of manufacturing thereof","description":"A semiconductor package comprises a semiconductor chip having an active surface with a conductive pad thereon; an electroplated Au—Sn alloy bump over the active surface; and a (glass) substrate compri","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9721913","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9721913","citation_suggestion":"Patentable. \"Semiconductor package and method of manufacturing thereof\" (US-9721913). https://patentable.app/patents/US-9721913","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9721913","json":"https://patentable.app/api/llm-context/US-9721913","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:02:15.080Z"}