{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9723724","patent":{"patent_number":"US-9723724","title":"Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate","assignee":null,"inventors":[],"filing_date":"2014-07-09T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","G02F","H01L","H01L"],"num_claims":8,"abstract":"A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate","description":"A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9723724","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9723724","citation_suggestion":"Patentable. \"Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate\" (US-9723724). https://patentable.app/patents/US-9723724","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9723724","json":"https://patentable.app/api/llm-context/US-9723724","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:59:55.862Z"}