{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9723729","patent":{"patent_number":"US-9723729","title":"Printed wiring board","assignee":null,"inventors":[],"filing_date":"2015-10-23T00:00:00.000Z","publication_date":"2017-08-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers, insulating layers and via conductors, and a first insulating layer formed on the first surface the substrate and covering the first conductor layer. The substrate has a cavity penetrating through the first insulating layer and substrate and exposing the build-up layer on the substrate, the via conductors include a lowermost via conductor having a bottom portion exposed at bottom of the cavity, and the bottom portion of the lowermost via conductor is recessed relative to surface of a lowermost insulating layer in the build-up layer at the bottom of the cavity."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board","description":"A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conduc","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9723729","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9723729","citation_suggestion":"Patentable. \"Printed wiring board\" (US-9723729). https://patentable.app/patents/US-9723729","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9723729","json":"https://patentable.app/api/llm-context/US-9723729","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:52:19.973Z"}