{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9726709","patent":{"patent_number":"US-9726709","title":"Semiconductor chip and method for detecting disconnection of wire bonded to semiconductor chip","assignee":null,"inventors":[],"filing_date":"2016-02-05T00:00:00.000Z","publication_date":"2017-08-08T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":8,"abstract":"A semiconductor chip is provided with first and second electrode pads, a first current detector, and a third electrode pad. The first and second electrode pads are both to be wire-bonded to a first lead terminal. The first current detector is connected between the first and second electrode pads. The third electrode pad is wire-bonded to a second lead terminal. A first closed circuit is configured by the first lead terminal, the first electrode pad, the first current detector, and the second electrode pad. An induced current flows through the first closed circuit when a current generating an induced electromotive force is applied to the third electrode pad. The first current detector is configured to output different values depending on whether the induced current exceeds a threshold value or not."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chip and method for detecting disconnection of wire bonded to semiconductor chip","description":"A semiconductor chip is provided with first and second electrode pads, a first current detector, and a third electrode pad. The first and second electrode pads are both to be wire-bonded to a first le","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9726709","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9726709","citation_suggestion":"Patentable. \"Semiconductor chip and method for detecting disconnection of wire bonded to semiconductor chip\" (US-9726709). https://patentable.app/patents/US-9726709","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9726709","json":"https://patentable.app/api/llm-context/US-9726709","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:56:35.294Z"}