{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9728500","patent":{"patent_number":"US-9728500","title":"Integrated circuit surface layer with adhesion-functional group","assignee":null,"inventors":[],"filing_date":"2015-12-17T00:00:00.000Z","publication_date":"2017-08-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"Embodiments of the present disclosure describe an integrated circuit and associated fabrication techniques and configurations, which may include forming on at least one of a metal layer or a polymer layer of an integrated circuit die a surface layer that includes an adhesion-functional group, and applying to the surface layer a next layer to adhere to the surface layer with the adhesion-functional group. In embodiments wherein the at least one of the metal layer or the polymer layer is a polymer layer, forming the surface layer may include copolymerizing on the polymer layer a polar monomer that includes the adhesion-functional group. In embodiments wherein the at least one of the metal layer or the polymer layer is a metal layer, forming the surface layer may include forming on the metal layer a self-assembled monolayer that includes amine group terminations. Other embodiments may be described and/or claimed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit surface layer with adhesion-functional group","description":"Embodiments of the present disclosure describe an integrated circuit and associated fabrication techniques and configurations, which may include forming on at least one of a metal layer or a polymer l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9728500","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9728500","citation_suggestion":"Patentable. \"Integrated circuit surface layer with adhesion-functional group\" (US-9728500). https://patentable.app/patents/US-9728500","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9728500","json":"https://patentable.app/api/llm-context/US-9728500","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:20:03.524Z"}