{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9728504","patent":{"patent_number":"US-9728504","title":"Interconnect structures and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2015-03-27T00:00:00.000Z","publication_date":"2017-08-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A method is provided for fabricating an interconnect structure. The method includes providing a substrate; and forming a first conductive layer; and forming a sacrificial layer on the substrate and the first conductive layer. The method also includes forming an opening exposing a surface of the first conductive layer in the sacrificial layer; and forming a catalyst layer on the exposed portion of the surface of the first conductive layer and a top surface of the sacrificial layer. Further, the method includes forming carbon nanotube bundles perpendicular to the surface of the substrate on the catalyst layer; and removing the sacrificial layer and the carbon bundles on the sacrificial layer. Further, the method also includes forming a first dielectric material layer covering top surfaces of the carbon nanotube bundles and a portion the surface of the substrate without carbon nanotubes to seal the carbon nanotube bundles in a space."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structures and fabrication method thereof","description":"A method is provided for fabricating an interconnect structure. The method includes providing a substrate; and forming a first conductive layer; and forming a sacrificial layer on the substrate and th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9728504","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9728504","citation_suggestion":"Patentable. \"Interconnect structures and fabrication method thereof\" (US-9728504). https://patentable.app/patents/US-9728504","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9728504","json":"https://patentable.app/api/llm-context/US-9728504","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:37:43.372Z"}