{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9728506","patent":{"patent_number":"US-9728506","title":"Strain engineering devices using partial depth films in through-substrate vias","assignee":null,"inventors":[],"filing_date":"2015-12-03T00:00:00.000Z","publication_date":"2017-08-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Through-substrate vias (TSVs) include a strain engineering layer configured to minimize or otherwise control local stress fields. The strain engineering layer can be separate from and in addition to a TSV sidewall isolation layer that is deposited along the via sidewall surface for the purpose of electric isolation. For instance, the strain engineering layer can be a partial depth layer that extends over only a portion of the TSV sidewall."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Strain engineering devices using partial depth films in through-substrate vias","description":"Through-substrate vias (TSVs) include a strain engineering layer configured to minimize or otherwise control local stress fields. The strain engineering layer can be separate from and in addition to a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9728506","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9728506","citation_suggestion":"Patentable. \"Strain engineering devices using partial depth films in through-substrate vias\" (US-9728506). https://patentable.app/patents/US-9728506","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9728506","json":"https://patentable.app/api/llm-context/US-9728506","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:46:54.914Z"}