{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9728507","patent":{"patent_number":"US-9728507","title":"Cap chip and reroute layer for stacked microelectronic module","assignee":null,"inventors":[],"filing_date":"2012-07-16T00:00:00.000Z","publication_date":"2017-08-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A cap chip or high density reroute layer for use in a stacked microelectronic module. A first set of electrically conductive reroute layers are defined on a sacrificial substrate. One or more stud bump columns are defined on an exposed conducive pad on a conductive reroute layer. One or more active or passive electronic elements, or both may be electrically coupled to one or more exposed conductive pads. The layer is encapsulated in an encapsulant and the stud bump columns exposed by removing a portion of the encapsulant. A second set of electrically conductive reroute layers is defined on the layer and electrically coupled to the stud bumps. The sacrificial substrate is removed to provide a cap chip or reroute layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Cap chip and reroute layer for stacked microelectronic module","description":"A cap chip or high density reroute layer for use in a stacked microelectronic module. A first set of electrically conductive reroute layers are defined on a sacrificial substrate. One or more stud bum","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9728507","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9728507","citation_suggestion":"Patentable. \"Cap chip and reroute layer for stacked microelectronic module\" (US-9728507). https://patentable.app/patents/US-9728507","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9728507","json":"https://patentable.app/api/llm-context/US-9728507","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:47:21.576Z"}