{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9728517","patent":{"patent_number":"US-9728517","title":"Semiconductor device and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2013-12-17T00:00:00.000Z","publication_date":"2017-08-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a substrate, a pad disposed on the substrate, a passivation disposed over the substrate, a post passivation interconnection (PPI) disposed over the passivation and the substrate, a conductive line isolated from the PPI, a bump disposed on the PPI and a polymeric composite between the PPI and the conductive line, wherein the polymeric composite includes a first layer conformal to the conductive line and PPI and a second layer filling a gap between the PPI and the conductive line. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing a passivation over the substrate, forming a post passivation interconnect (PPI) and a conductive line over the passivation, disposing a bump on the PPI, and forming a polymeric composite over the PPI by disposing a first layer conformal to the PPI and the conductive line and disposing a second layer to fill a gap between the PPI and the conductive line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and manufacturing method thereof","description":"A semiconductor device includes a substrate, a pad disposed on the substrate, a passivation disposed over the substrate, a post passivation interconnection (PPI) disposed over the passivation and the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9728517","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9728517","citation_suggestion":"Patentable. \"Semiconductor device and manufacturing method thereof\" (US-9728517). https://patentable.app/patents/US-9728517","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9728517","json":"https://patentable.app/api/llm-context/US-9728517","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:17:59.354Z"}