{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9731959","patent":{"patent_number":"US-9731959","title":"Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2014-11-26T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":18,"abstract":"An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same","description":"An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9731959","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9731959","citation_suggestion":"Patentable. \"Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same\" (US-9731959). https://patentable.app/patents/US-9731959","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9731959","json":"https://patentable.app/api/llm-context/US-9731959","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:35:35.847Z"}