{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9735079","patent":{"patent_number":"US-9735079","title":"Molding compound wrapped package substrate","assignee":null,"inventors":[],"filing_date":"2015-10-08T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A package substrate for chip/chips package wrapped by a molding compound is disclosed. The molding compound functions as a stiffener for the thin film package substrate. One embodiment discloses at least one redistribution layer (RDL) is prepared and the RDL is wrapped by a molding compound. The molding compound wraps four lateral sides and bottom side of the RDL. A top side of the RDL is made for a chip to mount and a bottom side of the RDL is planted a plurality of solder balls so that the bottom side of the chip package is adaptive to mount onto a system board in a later process."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Molding compound wrapped package substrate","description":"A package substrate for chip/chips package wrapped by a molding compound is disclosed. The molding compound functions as a stiffener for the thin film package substrate. One embodiment discloses at le","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9735079","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9735079","citation_suggestion":"Patentable. \"Molding compound wrapped package substrate\" (US-9735079). https://patentable.app/patents/US-9735079","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9735079","json":"https://patentable.app/api/llm-context/US-9735079","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:02:48.060Z"}