{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9735080","patent":{"patent_number":"US-9735080","title":"Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2015-10-06T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposing the first surface and being in contact with the carrier; forming on the carrier and on the wiring layer a dielectric body that has a first side having a first opening, from which a portion of the wiring layer is exposed, and a second side opposing the first side and disposed at the same side as the second surface of the wiring layer; and removing the carrier, with the second side of the dielectric body and the second surface of the wiring layer exposed. Therefore, a coreless package substrate is fabricated, and the overall thickness and cost of the substrate are reduced."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same","description":"A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9735080","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9735080","citation_suggestion":"Patentable. \"Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same\" (US-9735080). https://patentable.app/patents/US-9735080","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9735080","json":"https://patentable.app/api/llm-context/US-9735080","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:18:03.502Z"}