{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9735095","patent":{"patent_number":"US-9735095","title":"Semiconductor component and method of manufacture","assignee":null,"inventors":[],"filing_date":"2016-07-07T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In accordance with an embodiment, a semiconductor component includes a support having first and second device receiving structures. A semiconductor device configured from a III-N semiconductor material is coupled to the support, wherein the semiconductor device has opposing surfaces. A first bond pad extends from a first portion of the first surface, a second bond pad extends from a second portion of the first surface, and a third bond pad extends from a third portion of the first surface. The first bond pad is coupled to the first device receiving portion, the drain bond pad is coupled to the second device receiving portion, and the third bond pad is coupled to the third lead. In accordance with another embodiment, a method includes coupling a semiconductor chip comprising a III-N semiconductor substrate material to a support."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor component and method of manufacture","description":"In accordance with an embodiment, a semiconductor component includes a support having first and second device receiving structures. A semiconductor device configured from a III-N semiconductor materia","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9735095","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9735095","citation_suggestion":"Patentable. \"Semiconductor component and method of manufacture\" (US-9735095). https://patentable.app/patents/US-9735095","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9735095","json":"https://patentable.app/api/llm-context/US-9735095","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:19:04.224Z"}