{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9735098","patent":{"patent_number":"US-9735098","title":"Wiring substrate and semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-11-03T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A wiring substrate including an insulation layer, a connection terminal projecting from an upper surface of the insulation layer, a protective insulation layer formed on the upper surface of the insulation layer covering a lower side surface of the connection terminal, and a cover layer covering an upper side surface and an upper surface of the connection terminal exposed from the protective insulation layer. The protective insulation layer includes an upper surface defining a protrusion bulged upward around the connection terminal. The protrusion includes a peak, a first slope inclined downward from the peak and extending toward the connection terminal, and a second slope inclined downward from the peak and extending away from the connection terminal. The cover layer further covers the first slope, the peak, and a part of the second slope."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate and semiconductor device","description":"A wiring substrate including an insulation layer, a connection terminal projecting from an upper surface of the insulation layer, a protective insulation layer formed on the upper surface of the insul","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9735098","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9735098","citation_suggestion":"Patentable. \"Wiring substrate and semiconductor device\" (US-9735098). https://patentable.app/patents/US-9735098","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9735098","json":"https://patentable.app/api/llm-context/US-9735098","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:02:39.072Z"}