{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9735138","patent":{"patent_number":"US-9735138","title":"Integrated circuit package and method of making the same","assignee":null,"inventors":[],"filing_date":"2015-10-23T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A method of making an integrated circuit package includes: (a) forcing a circuit layered structure that includes a metal substrate and a circuit pattern, the metal substrate having opposite first and second surfaces, the circuit pattern including at least two spaced apart die contacts that protrude from the first surface of the metal substrate, the metal substrate directly interconnecting the die contacts; (b) bonding first and second terminal contacts of an electronic die to the die contacts, respectively; and (c) forming an insulator layer on the first surface of the metal substrate to encapsulate the die and the die contacts after step (b)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package and method of making the same","description":"A method of making an integrated circuit package includes: (a) forcing a circuit layered structure that includes a metal substrate and a circuit pattern, the metal substrate having opposite first and ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9735138","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9735138","citation_suggestion":"Patentable. \"Integrated circuit package and method of making the same\" (US-9735138). https://patentable.app/patents/US-9735138","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9735138","json":"https://patentable.app/api/llm-context/US-9735138","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:59:33.947Z"}