{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9735325","patent":{"patent_number":"US-9735325","title":"Semiconductor device and manufacturing method of semiconductor device","assignee":null,"inventors":[],"filing_date":"2015-03-04T00:00:00.000Z","publication_date":"2017-08-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"According to one embodiment, a manufacturing method of a semiconductor device includes the transferring a first group from a first support to a second support; the deforming the second support to convert each pitch of the semiconductor chips in the first group transferred on the second support into a second pitch different from the first pitch; the forming an insulating layer around each of the semiconductor chips, the insulating layer covering each of the semiconductor chips in the first group arranged in the second pitch; and the dicing the insulating layer. The first group is selected from a plurality of semiconductor chips supported by the first support. The plurality of semiconductor chips is arranged in an initial pitch. The first group is arranged in a first pitch being longer than the initial pitch."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and manufacturing method of semiconductor device","description":"According to one embodiment, a manufacturing method of a semiconductor device includes the transferring a first group from a first support to a second support; the deforming the second support to conv","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9735325","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9735325","citation_suggestion":"Patentable. \"Semiconductor device and manufacturing method of semiconductor device\" (US-9735325). https://patentable.app/patents/US-9735325","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9735325","json":"https://patentable.app/api/llm-context/US-9735325","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:31:02.476Z"}