{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9738056","patent":{"patent_number":"US-9738056","title":"Systems of bonded substrates and methods for bonding substrates","assignee":null,"inventors":[],"filing_date":"2015-09-23T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In one embodiment, a system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer positioned between the first substrate and the second substrate. The composite boding layer may include an interior bond region, an exterior bond region, and a metal matrix. The material of the interior bond region may have a greater elastic modulus than the material of the exterior bond region. A portion of the metal matrix may be in the interior bond region and a portion of the metal matrix may be in the exterior bond region. The composite bonding layer may also include a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems of bonded substrates and methods for bonding substrates","description":"In one embodiment, a system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer positioned between the first substrate and the second substrate. The c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9738056","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9738056","citation_suggestion":"Patentable. \"Systems of bonded substrates and methods for bonding substrates\" (US-9738056). https://patentable.app/patents/US-9738056","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9738056","json":"https://patentable.app/api/llm-context/US-9738056","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:29:22.702Z"}