{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741536","patent":{"patent_number":"US-9741536","title":"High aspect ratio structure analysis","assignee":null,"inventors":[],"filing_date":"2013-10-04T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["G01N"],"num_claims":25,"abstract":"Curtaining artifacts on high aspect ratio features are reduced by reducing the distance between a protective layer and feature of interest. For example, the ion beam can mill at an angle to the work piece surface to create a sloped surface. A protective layer is deposited onto the sloped surface, and the ion beam mills through the protective layer to expose the feature of interest for analysis. The sloped mill positions the protective layer close to the feature of interest to reduce curtaining."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High aspect ratio structure analysis","description":"Curtaining artifacts on high aspect ratio features are reduced by reducing the distance between a protective layer and feature of interest. For example, the ion beam can mill at an angle to the work p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741536","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741536","citation_suggestion":"Patentable. \"High aspect ratio structure analysis\" (US-9741536). https://patentable.app/patents/US-9741536","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741536","json":"https://patentable.app/api/llm-context/US-9741536","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:25:01.535Z"}