{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741584","patent":{"patent_number":"US-9741584","title":"Densification of dielectric film using inductively coupled high density plasma","assignee":null,"inventors":[],"filing_date":"2016-05-05T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A method for densifying a dielectric film on a substrate includes arranging a substrate including a dielectric film on a substrate support in a substrate processing chamber; supplying a gas mixture including helium and oxygen to the substrate processing chamber; controlling pressure in the substrate processing chamber to a pressure greater than or equal to a predetermined pressure; supplying a first power level at a first frequency to a coil to create plasma in the substrate processing chamber. The coil is arranged around an outer surface of the substrate processing chamber. The method includes densifying the dielectric film for a predetermined period. The pressure and the first power level are selected to prevent sputtering of the dielectric film during densification of the dielectric film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Densification of dielectric film using inductively coupled high density plasma","description":"A method for densifying a dielectric film on a substrate includes arranging a substrate including a dielectric film on a substrate support in a substrate processing chamber; supplying a gas mixture in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741584","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741584","citation_suggestion":"Patentable. \"Densification of dielectric film using inductively coupled high density plasma\" (US-9741584). https://patentable.app/patents/US-9741584","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741584","json":"https://patentable.app/api/llm-context/US-9741584","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:21:03.537Z"}