{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741586","patent":{"patent_number":"US-9741586","title":"Method of fabricating package structures","assignee":null,"inventors":[],"filing_date":"2015-06-30T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Some embodiments contemplate methods for forming a package structure and a package structure formed thereby. An embodiment method includes depositing a photosensitive dielectric layer on a support structure; forming a first layer on a surface of the photosensitive dielectric layer; exposing the photosensitive dielectric layer to radiation; and after the forming the first layer and the exposing to radiation, developing the photosensitive dielectric layer. The support structure includes an integrated circuit die. The layer has a different removal selectivity than the photosensitive dielectric layer during the developing. According to some embodiments, a thickness uniformity of the photosensitive dielectric layer after developing may be increased, and thickness loss from developing the photosensitive dielectric layer can be reduced."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of fabricating package structures","description":"Some embodiments contemplate methods for forming a package structure and a package structure formed thereby. An embodiment method includes depositing a photosensitive dielectric layer on a support str","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741586","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741586","citation_suggestion":"Patentable. \"Method of fabricating package structures\" (US-9741586). https://patentable.app/patents/US-9741586","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741586","json":"https://patentable.app/api/llm-context/US-9741586","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:23:27.220Z"}